Features: Versatile Bonding Capability: This product is designed for bonding various types of FPC, COF, TAB, LED panels, and PCB combinations. It supports bonding for LED panels of different sizes and configurations, including vertical, horizontal, vertical band, horizontal band, black belt, colored thread, ribbon, multi-line, black and white, vertical half display, and horizontal half breakdown maintenance. Flexible Size Compatibility: The machine is capable of handling LED panels of sizes up to 65 inches, with an expandable platform to accommodate different panel sizes. Single Head and Pneumatic Device: Featuring a single head and single pneumatic device design, along with single temperature control, ensuring simplicity and ease of operation. Precision Bonding: Achieves high working precision with an accuracy of ±0.015mm, enabling precise bonding results. Compact and Space-Saving Design: With dimensions of 860*860*1450mm, the machine offers a compact footprint, ideal for space-c
Specification:
Applicable LED size: Max 65 inches.
Applicable LED panel Thickness: 0.3-1.1mm.
Heating mode: Pulse Heat.
Working precision: ±0.015mm.
Machine size: 860*860*1450mm.
Weight: 250KG.
Input Power: 3500W.
Rated Power(w): AC 220V.
Work pressure: 0.1~0.7Mpa Dry air source.
Operation mode: 7-inch touch screen control.
Alignment system: 2 High-definition C/LCCD camera.
Temperature error range: ±0.5°C.
Programming control device: PLC.
TAB fixture: micrometer X, Y, Z Axis adjust.
Platform moving: Manual Operation.
Hot press head size: 50*1.4*10mm.
